Not long ago, Apple really announced the release of a new generation of iPhone 14, which continued a year's update habit. Many users lamented that "the original iPhone has debuted 14" and won millions of networks in the Chinese market in a short time in a short time. Booking, it can be seen that the iPhone is still welcomed by young people.
Smart phone set off the first round of precision laser processing needs
Thinking about more than ten years ago, when the smartphone was just launched, the industrial laser processing technology was still at a lower level. Fiber laser laser and ultra -fast laser were new things. It was blank in China. Precision laser processing could not be mentioned. Since 2011, low -end precision marks have gradually begun to be applied in China. At that time, it mainly talked about small -power solid pulse green light and ultraviolet laser. At this time, ultra -fast laser technology began to mature commercial use in China, super fast and precision Laser processing began to talk about it.
The batch application of precision laser processing is largely benefited from the promotion of smartphones. Camera glass, fingerprint modules, HOME keys, camera blind holes, heterosexual cutting of mobile phone panels, all due to the breakthrough of ultra -fast laser precision cutting technology. In particular, several domestic laser precision processing equipment vendors include the precision processing businesses of the Grand clan, Shengxiong laser, Delong laser, and other precision processing business are all from consumer electronics processing. It can be said that the precision processing boom of the previous round was driven by consumer electronics, especially smartphones and display panels.
Since 2021, consumer products such as smartphones, wearing bracelets, and display panels have shown a decline, which has led to weakened demand for consumer electronics processing equipment, and the growth of precision laser processing equipment is facing great pressure. So can the new iPhone14 make a new round of processing boom? According to the current trend of reducing the willingness of mobile phones, it is almost certain that if the smartphone does not have a revolutionary technical breakthrough, it cannot bring a new increase in market demand. A few years ago, it became a hot spot 5G and folding screen mobile phones. Stock replacement.
So, where is the outbreak of the demand for precision laser processing in the next round of precision laser processing?
The rise of China's semiconductor and chip industry
China is a veritable world factory. In 2020, the added value of my country's manufacturing industry accounts for 28.5%of the world. Because of the huge manufacturing industry, it brings huge market potential to laser processing and manufacturing. However, my country's manufacturing industry has accumulated weakly in the early stage. Most of them belong to the low -end industries. The industry has been upgraded in the past ten years. The rapid development of laser equipment has greatly reduced the gap with foreign advanced levels.
Only in the chip industry, my country is still greatly restricted by foreign countries, especially in the United States in recent years, attempting to carry out siege supply to my country's chips in recent years. The global chip industry has formed an industrial chain of American design and development, Japan's provision of raw materials, and Taiwan and Taiwan. As the world's largest semiconductor and chip consumer market, Mainland China is relatively lagging behind the chip industry. The chip sales of the Chinese market reached 192.5 billion US dollars, accounting for 34%of global sales. Chip technology, so the country has vigorously supported the development of the chip industry in 4 years and included it in the medium and long -term strategic plan.
Statistics from the International Semiconductor Industry Association show that the construction plant in mainland China ranks first in the world. It is estimated that by the end of 2024, 31 large wafer fabs will be built, which mainly locks the mature process. During the period, it is scheduled to be put into operation 19 and 12 in the United States.
Not long ago, my country announced that the Shanghai integrated circuit industry broke through the process of 14nm chips and achieved a certain scale of mass production. For some chips above 28nm used in home appliances, cars, and communications, my country has a very mature manufacturing process, which can well meet my country's overall needs for most chips. As the United States introduces a chip bill, the competition between China and the United States in chip technology is more intense, and there may be excess supply. In 2021, China's imported chips have begun to decline sharply.
Laser processing in semiconductor chip
Walls are the basic materials for semiconductor products and chips. After the wafer grows, it needs to be mechanically polished. In the later period, the important wafer cutting and processing, also known as wafers. Early short -pulse DPSS laser cutting wafers have matured in Europe and the United States. With the rapid development and power improvement of ultra -fast laser, ultra -fast laser cutting wafers will gradually become the mainstream in the future, especially in the process of wafer cutting, micro -drilling, seal testing and other processes.
At present, there are already precision laser equipment manufacturers in China that can provide wafer slotting equipment. It can apply the surface slot of the 12 -inch wafer of the remaining 28nm process, and the application of laser wafer hidden equipment to MEMS sensor chips, storage chips and other high -end chips manufacturing field. In 2020, a large laser company in Shenzhen has developed laser solutions and combined equipment to achieve glass chips and silicon wafers, which can be used for high -end semiconductor chip applications.
In the middle of 2022, a laser enterprise in Wuhan launched the industry's first automatic laser modified cutting equipment, which was successfully applied to laser surface treatment in the chip field. The device uses high -precision femtosecond laser and uses extremely low pulse energy. It is treated with laser modification within the surface of the micron range for the surface of the semiconductor material, which greatly improves the performance of semiconductor optoelectric computers. It is suitable for high -cost, narrow channel (≧ 20um) compound semiconductor SIC, GaaS, Litao3 and other wafer chips such as silicon chips, MEMS sensor chips, COMS chips, etc.
The key technologies of my country's Zhang Zai offensive light carved machine equipment will drive the needs of standards and extremely ultraviolet laser in the optical carciers involved, and the second ago my country was almost blank in this regard.
Precision laser processing towards high -end chips or the next round of boom
Due to the weak semiconductor chip industry in my country in the past, the research and application of laser processing chips were relatively small, but some applications obtained from the downstream consumer electronics terminals were first assembled. In the future, the main markets of precision laser processing in my country will gradually move from general electronic parts processing to upstream materials and core components, especially semiconductor materials, biomedical, polymer polymer materials and other equipment.
The laser application process of the semiconductor chip industry will be more and more invented. For high -precision chip products, non -contact light processing is the most suitable way. With the huge demand, the chip industry is likely to hold up the demand for the next round of precision laser processing equipment.
